Depth-Profiling of Surface-Segregated Composition Spread Alloy Films
نویسنده
چکیده
It is common for the components in a homogeneous metallic alloy to separate at its surface. This phenomenon is known as surface segregation. For example, under certain conditions, the surface layer of atoms in a Cu85Pd15 is pure copper, while the second layer of atoms is 50% copper. The bulk retains its 85/15 composition. A depth-profile characterizes the surface segregation by describing the atomic fraction of each element as a function of depth. To study the effects that each alloy composition has on the degree of surface segregation, researchers have developed a composition spread alloy film, a material that contains all possible alloy compositions on a single substrate. We use angle-resolved x-ray photospectroscopy data collected from a copper-palladium composition spread alloy film to estimate the depth-profiles for sampled alloys using both a constrained linear regression and a full Bayesian model. We extend these models to predict the depth-profile for any alloy composition while allowing for measurement error given the novelty of the composition spread alloy film.
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